15-19 September 2008
The main themes for original contributions to be submitted to ESSDERC 2008 include, but are not limited to the following:
Advanced Devices
CMOS scaling; high performance, low power, and low voltage devices; SOI,
SGOI, and SiON devices; SiGe, Ge, and strained devices; nano devices and
related device physics; double and multi gate transistors; high mobility
and ballistic devices.
Processing & Integration
Advances in integration for ULSI; SOI, SGOI, and SiON processing; 3D integration;
new materials for CMOS; ICs patterning techniques; gate dielectrics; high
k; gate stack and junction technology; silicidation; interconnects; low
k dielectrics; damascene processing; cleaning and surface preparation.
Telecommunication & Power Devices
RF CMOS; passives; antennas; filters; resonators; inductors; RF MEMS/switches;
SAW, BAW, and FBAR; oscillators, HBT; HEMT; bipolar devices; BiCMOS; high
voltage and high power devices; SiC; high temperature operation; CMOS compatible
power devices.
Modelling and Simulation
Compact, numerical, and physical modeling; device simulation; behavior models;
quantum mechanical and non-stationary transport phenomena; ballistic transport;
scattering models; process dispersions, parameter fluctuations, variability;
TCAD; mixed electrical-thermal modelling and simulation.
Characterisation and Reliability
Characterisation techniques; parameter extraction; advanced test structures
and methods; noise; gate dielectric, device, and interconnect reliability;
CHE effects; NBTI; SILC; memory retention; process-induced damages, ESD,
EMI; defect monitoring and control; metrology.
Memory, SoC & SiP
Embedded and stand-alone memories; DRAM, FeRAM, MRAM, PCRAM, CBRAM, Flash,
SONOS; nanocrystal memories; single and few electron memories; 3D IC stacks;
integrated MEMS and NEMS; integration of detectors, sensors, and actuators;
CCDs and CMOS imagers; optical onchip communication, optical links; display
technologies; TFTs; IC cooling techniques; SoC and SiP packaging; microsystem
packaging.
Emerging Technologies, Sensors & Actuators
Nanotubes; single-electron, molecular and quantum devices; spintronics;
self-assembling structures and emerging materials; photonic devices; light
emission, APDs, single photon detectors; polymer transistors, sensors, light-emitting
diodes and optoelectronic devices; flexible displays; biochemical sensors
and actuators; microfluidic devices; micromachining; MEMS and NEMS.
Joint ESSDERC / ESSCIRC Sessions:
These sessions will focus on topics that that straddle the boundary between
design and technology and are planned to include Sensors and Imagers, Integration
of IC designs with other technologies and materials, Yield and Reliability
related technology developments and Design for Manufacture
The 2008 ESSCIRC conference will allow only electronic submission of papers
in PDF format. Prospective authors must submit their paper(s) via the conference
website.
Papers must be submitted in the final format to be published in the proceedings.
They must not exceed four A4 pages with all illustrations and references
included. The size of the PDF files submitted must not exceed 2 MBytes.
Manuscript guidelines as well as instructions on how to submit electronically
will be available here shortly.
After selection of the papers for the conference, the authors will be informed of the decision of the Technical Programme Committee by e-mail at the beginning of June 2008. At the same time, the complete programme will be published on the conference website. The working language of the conference is English, which must also be used for all presentations and printed material.
Papers submitted for review must clearly state:
The degree to which the paper deals with the above issues is fundamental to a successful review and selection of the paper. The most frequent cause of rejections of submitted papers is a lack of new results. Only work that has not been previously published at the time of the conference will be considered. Submission of a paper for review and subsequent acceptance is considered by the committee as a commitment that the work will not be placed in the public domain prior to the conference.